Method and apparatus for punch and place inserts for manufacture of oxygen sensor
US6306677A · kind A · utility
4Cited by
3References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 7, 2000 |
| Grant date | Oct 23, 2001 |
| Priority date | — |
| Expiry date | Mar 7, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49897
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Disclosed herein is an apparatus and process for punching and placing inserts of electrolyte and other material into a substrate layer for a gas sensor. The insert can be the solid electrolyte, porous electrolyte or protective layer of a gas sensor. The substrate material is typically alumina. The apparatus punches a hole in the alumina substrate, and then, in one step, punches an insert of a second material, such as a solid electrolyte, into the previously formed hole, thereby forming a composite layer/insert.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.