Thermal conductive silicone rubber compositions and making method
US6306957A · kind A · utility
49Cited by
2References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 9, 2000 |
| Grant date | Oct 23, 2001 |
| Priority date | — |
| Expiry date | Mar 9, 2020 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G77/70
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An organopolysiloxane, a hydrolyzable group-bearing methylpolysiloxane, a thermal conductive filler, and a curing agent are blended to form a silicone rubber composition which is minimized in viscosity or plasticity increase and remains effectively moldable and workable even when loaded with a large amount of the thermal conductive filler. It cures into a silicone rubber part having a high thermal conductivity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.