Overmolded electronic module with underfilled surface-mount components
US6307749A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 23, 2000 |
| Grant date | Oct 23, 2001 |
| Priority date | — |
| Expiry date | Oct 23, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20854
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An overmolded electronic module and a method for forming the module. The method entails both overmolding a circuit board and underfilling one or more surface-mount circuit devices physically and electrically connected to the board with solder bump connections. The circuit board is supported on a heatsink that thermally contacts a surface of the device opposite the circuit board. The board is optionally then encased on the heatsink with a retainer that includes means for biasing the circuit device against the heatsink. Finally, the circuit board is overmolded with a polymeric material to form an overmolded body that encases the circuit board and the circuit device with the heatsink. The overmold process is carried out so that a portion of the overmolded body completely underfills the circuit device and encapsulates its solder bump connections.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.