Heat sink
US6308772A · kind A · utility
6Cited by
8References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 9, 1999 |
| Grant date | Oct 30, 2001 |
| Priority date | — |
| Expiry date | Jun 9, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink provided with a heat conducting section 8 having a heat absorbing surface in contact with the heat emitting component, and fins 10 formed by being projected from the said heat conducting section 8, said fins 10 having air holes 11, and heat conducting section 8 being provided with clamps 7 for fixing to the heat emitting component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.