IC module, method of manufacturing the same and IC card provided with IC module
US6308894A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 12, 1999 |
| Grant date | Oct 30, 2001 |
| Priority date | — |
| Expiry date | Mar 12, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01079
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
In the method of manufacturing an IC module (1) including a resin packaging process using upper and lower dies (5) for forming a cavity (50) while the dies are clamped, the resin packaging process is carried out by introducing a melted resin while a substrate (2) on which an IC chip (3) is placed and a coil (20A) which has a doughnut shape when observed from above and is flattened as a whole are housed in the cavity (50). When a substrate (2) on which an antenna coil (20) is patterned is to be packaged with a resin, the resin packaging process is carried out by forming a spacer (28) having an equal and almost equal height to the height of the cavity (50) on the substrate (2), housing it in the cavity (50), and introducing a melted resin. Instead of forming the spacer (28) on the substrate (2), a substrate (2) housed in a cavity (50) may be sucked. The manufacturing method can provide good protection of an IC chip and an antenna coil.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.