Patent · US Expired

High density wirebond connector assembly

US6309224A · kind A · utility

0Cited by

6References

16Claims

0Family size

Assignee

Delphi Technologies · US

Inventors

Daniel A. Lawlyes · Kokomo, US
Jay Kelly · Kokomo, US
Anthony Raschilla · Girard, US

Key dates

Filing date	Dec 20, 1999
Grant date	Oct 30, 2001
Priority date	—
Expiry date	Dec 20, 2019

Classification

Technology area (CPC H)Electricity
CPC primaryH05K3/328
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

A high density wirebond connector assembly (10), including an enclosure (12), a circuit board (14), a high density connector (16), a connector housing (18), and a plurality of nail contacts (20). The circuit board (14) is comprised of a plurality of laminate layers (26) and rows of wirebond pads (28) positioned on the laminate layers (26). A plurality of wirebonds (32) run between individual nail contacts (20) and individual wirebond pads (28). By increasing the density of the high density connector (16), and decreasing the distance between the wirebond pads (28) and the nail contacts (20), a smaller, lighter, cheaper, and vibrationally resistant high density connector assembly (10) is provided.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.