Arrangements for wafer polishing
US6309279A · kind A · utility
34Cited by
26References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 19, 1999 |
| Grant date | Oct 30, 2001 |
| Priority date | — |
| Expiry date | Feb 19, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68707
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Wafer polishing systems include a series of polish modules alongside a neighboring series of secondary modules. A conveyor travels along the series of polish modules and the series of secondary modules. When a polishing operation is completed, the wafers are transferred to a series of near-by storage modules. The polish modules include a pair of traveling wafer gantries, each of which delivers a wafer to a polishing surface, applying the necessary force to complete polishing of the wafer surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.