Manufacturing method for high precision mold
US6309488A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 23, 1999 |
| Grant date | Oct 30, 2001 |
| Priority date | — |
| Expiry date | Nov 23, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D1/10
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A manufacturing method for a high precision mold comprises the steps of (a) placing a plastic body on a conductor substrate, (b) forming a plurality of perforating apertures in the plastic body using X-ray deep etching molding, (c) rounding the edges at the front end of the perforating apertures using ultraviolet (UV) lithography, and (d) electroforming the high precision mold using the plastic body with perforating apertures as a model. A fiber connector sleeve can be further manufactured by (e) molding a fiber aligning element using the high precision mold, (f) molding a fiber sleeve body using an usual mold, and (g) combining the fiber aligning element with the fiber sleeve body using ultrasonic waves to form the fiber connector sleeve.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.