Method of manufacturing enhanced finish sputtering targets
US6309556A · kind A · utility
14Cited by
10References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 3, 1998 |
| Grant date | Oct 30, 2001 |
| Priority date | — |
| Expiry date | Sep 3, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24355
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method is provided for achieving an enhanced finish on a sputter target surface that results in good film uniformity, low particle counts, and little to no bum-in time. The method involves chemically etching the surface of the sputter target by immersing the surface one or more times in an etching solution, with intermediate rinsing steps. The result is a surface substantially free of mechanical deformation that exhibits a surface similar to a sputtered target with a surface roughness of 10-30 .mu.in.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.