Induction heating method for manifold in hot runner mold
US6310333A · kind A · utility
6Cited by
3References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 5, 2000 |
| Grant date | Oct 30, 2001 |
| Priority date | — |
| Expiry date | Dec 5, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C33/06
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
In an induction heating method for a manifold in a hot runner mold, it is possible to uniformly heat a material over the entire length of a runner. Also, a coil is easily attached to and detached from the manifold. The hot runner mold includes a fixed mold and a movable mold, and a space is provided along a side surface of the manifold on which clamping force applied by the fixed mold and the movable mold does not act. A coil is wound to the side surface along an axial line of a runner of the manifold within the space such that the manifold is induction-heated from the side surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.