Semiconductor die having input/output cells and contact pads in the periphery of a substrate
US6310402A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jun 25, 1999 |
| Grant date | Oct 30, 2001 |
| Priority date | — |
| Expiry date | Jun 25, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The width of an input/output forming region is matched with the minimum width adoptable as a layout interval between pads in advance. Pads corresponding to (least common multiple).div.(layout interval between pads) in number are disposed so as to correspond to input/output cells corresponding to (least common multiple).div.(width of input/output cell forming region) in number, based on the least common multiple between the width of each input/output cell forming region and the layout interval between the pads. Owing to such a construction, a semiconductor device can be provided which meets user demands with ease and in a short time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.