Silicon alloys for electronic packaging
US6312535A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2000 |
| Grant date | Nov 6, 2001 |
| Priority date | — |
| Expiry date | Mar 27, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12486
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method of producing a silicon based alloy is described which comprises melting a silicon alloy containing greater than 50 wt. % silicon and preferably including aluminium. The melted alloy is then inert gas atomized to produce powder or a spray formed deposit in which the silicon forms a substantially continuous phase made up of fine, randomly oriented crystals in the microstructure. The alloy produced by the method has particularly useful application in electronics packaging materials and a typical example comprises an alloy of 70 wt. % silicon and 30 wt. % aluminium. Such an alloy is an engineering material which, for example, is machinable.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.