Conductive insert for bonding components with microwave energy
US6312548A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 29, 1996 |
| Grant date | Nov 6, 2001 |
| Priority date | — |
| Expiry date | Mar 29, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2922
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The bonding of components is facilitated by a conductive pattern which generates heat upon being irradiated with microwave or RF energy. The electrically conductive pattern is positioned on a first component surface and a curable resin having adhesive properties is applied thereto. A second component surface is placed in contacting relation with the resin and the conductive pattern is irradiated with microwave or RF energy to facilitate curing wherein the components are bonded together along the pattern. The conductive pattern can be utilized without adhesive resin wherein heat generated via the application of microwave or RF energy causes components to fuse together. The conductive pattern can be enveloped by polymeric material, wherein the polymeric material becomes the adhesive for bonding components when microwave or RF energy is applied.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.