Method and device for processing semiconductor material
US6313013A · kind A · utility
5Cited by
9References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 1, 1999 |
| Grant date | Nov 6, 2001 |
| Priority date | — |
| Expiry date | Oct 1, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC30B15/02
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
There are a device and method for protecting semiconductor material, wherein semiconductor material is processed on a surface of stabilized ice made from ultrapure water and particles of semiconductor material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.