Mask orbiting for laser ablated feature formation
US6313435A · kind A · utility
85Cited by
17References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 20, 1998 |
| Grant date | Nov 6, 2001 |
| Priority date | — |
| Expiry date | Nov 20, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A Method and Apparatus for ablating features from a substrate, such as drilling holes in a polymer substrate for an ink jet printhead, by illuminating the substrate that has passed through a mask that is continuously orbited or moved in a two dimensional pattern. The mask is capable of following a trajectory perpendicular to the angle of the radiation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.