Power semiconductor module and motor drive system
US6313598A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 28, 2000 |
| Grant date | Nov 6, 2001 |
| Priority date | — |
| Expiry date | Jan 28, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/202
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A power semiconductor module comprising a power semiconductor element included in a power circuit portion and mounted on a metal base, a first resin molded to the power semiconductor element, a control circuit element disposed on the first resin and included at least in a portion of the control circuit, and a control terminal connected to the power circuit portion and having an exposed portion thereof in the surface of the first resin, in which a portion of the control circuit is connected with the power circuit portion at the exposed portion of the control terminal. Accordingly, a resin mold type power semiconductor module capable of realizing a high performance of the control circuit portion at low cost can be realized.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.