Thermal connector for joining mobile electronic devices to docking stations
US6313987A · kind A · utility
23Cited by
36References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 1998 |
| Grant date | Nov 6, 2001 |
| Priority date | — |
| Expiry date | Sep 30, 2018 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/1632
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A heat exchanger adapated for heat dissipation. A first heat transfer element has an end which forms an engaging surface. A second heat transfer element has a receptacle portion which is integrally formed and has an engaging surface that is urged against the engaging surface of the first heat transfer element when the first heat transfer element and the second heat transfer element are mated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.