Power electronics system with fully-integrated cooling
US6313991A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 24, 2000 |
| Grant date | Nov 6, 2001 |
| Priority date | — |
| Expiry date | Jul 24, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20927
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thermally cooled power electronics system. A cooling housing has a body with a coolant cavity formed in one surface and a capacitor bus assembly potting cavity formed in an opposite surface. A bus bar passthrough opening is formed through the body, along with a coolant inlet and outlet manifolds having a coolant cavity inlet outlet that are coupled to respective ends of the coolant cavity. An environmental sealing gasket surrounds the coolant cavity. A plurality of laminated copper bus bars are disposed through the bus bar passthrough opening. A laminated horizontal bus bar assembly extends along the length of the housing above the coolant cavity and has horizontal bus bars that are coupled to the laminated copper bus bars. A battery input connector is coupled by way of a vertical bus bar assembly to the horizontal bus bar assembly. A plurality of power switching devices are coupled to the laminated horizontal bus bar assembly. A heat sink is coupled to the plurality of power switching devices and thermally coupled to the coolant cavity. A plurality of capacitors are secured in the capacitor bus assembly potting cavity that are coupled by way of the laminated copper bus bars to t…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.