Cooling system of a printed board
US6313995A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 12, 2000 |
| Grant date | Nov 6, 2001 |
| Priority date | — |
| Expiry date | Jun 12, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20509
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A cooling system can cool electronic devices with assurance following the heights of the electronic devices mounted on a printed board. The cooling system is thin and light in weight and can easily inspect and maintain the electronic devices. A cooling pipe is disposed in a U-shape about a plurality of electronic devices mounted on the printed board. The cooling pipe is jointed with the cooling plate by caulking from the opposite side of the printed board. A thermal conduction plate is engaged with the cooling plate from the upper portion thereof and the thermal conduction members each having the notched portion are inserted into the insertion holes of the thermal conduction plate. The thermal conduction members can be slid up and down and turned to the right and left in the insertion holes and they are pressed and biased against the electronic devices by a leaf spring provided on the thermal conduction plate. Each electronic device can be inspected by inserting a probe or the like through the notched portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.