Self alignment device for ball grid array devices
US6313999A · kind A · utility
12Cited by
22References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 10, 1999 |
| Grant date | Nov 6, 2001 |
| Priority date | — |
| Expiry date | Jun 10, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49179
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An apparatus which aligns a ball grid array (BGA) device over a substrate. The apparatus preferably includes a cup-shaped member for cupping and holding the solder balls of the BGA device, and an elongate member attached to the cup-shaped member. The cup-shaped member is attached between the BGA device and the substrate at two or more different positions so that the solder balls of the BGA device become aligned over the terminals of the substrate by operation of gravity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.