Thermal inkjet printhead and high-efficiency polycrystalline silicon resistor system for use therein
US6315384A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2000 |
| Grant date | Nov 13, 2001 |
| Priority date | — |
| Expiry date | Jun 26, 2020 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC07D417/12
- WIPO fieldOrganic fine chemistry
- WIPO sectorChemistry
Abstract
A highly-efficient thermal inkjet printhead. The printhead includes a primary layer of polycrystalline silicon (preferably doped) having at least one portion thereof which functions as an ink expulsion resistor. Positioned over and above the primary layer is a secondary layer of material having at least one section produced from a selected metal silicide compound and at least another section fabricated from undoped polycrystalline silicon. The metal silicide-containing section functions as an interconnect structure and is operatively connected to the resistor in the primary layer (which is positioned beneath the secondary layer). The undoped polycrystalline silicon section is at least partially aligned over and above the resistor. As a result, the resistor is "buried" beneath the secondary layer and the various portions thereof. This system provides improved reliability, greater dimensional simplicity, optimized electrical/thermal properties, and superior versatility.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.