Wire enamels containing polyesterimides and/or polyamideimides with polyoxyalkylenediamines as molecular elements
US6316046A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 30, 1999 |
| Grant date | Nov 13, 2001 |
| Priority date | — |
| Expiry date | Mar 30, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01B3/306
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The invention relates to wire enamels comprising as binders polyesterimide and/or polyamideimide, the binders comprising as monomeric building blocks polyoxyalkylenediamine having terminal amino groups. The polyoxyalkylenediamines are preferably selected from the group polyoxyethylenediamine, polyoxypropylenediamine and polyoxyethylenepropylenediamine. The invention also encompasses the use of the novel wire enamels for coating copper wires, especially thick round wires or profiled wires.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.