Electroless plating process for alternative memory disk substrates
US6316097A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 15, 1999 |
| Grant date | Nov 13, 2001 |
| Priority date | — |
| Expiry date | Sep 15, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/265
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Magnetic recording media including an alternative substrate material having a Young's Modulus greater than that of Al-based substrate materials and a preselected average surface roughness (Ra) are formed by depositing a continuous, adherent, non-magnetic, catalytically active layer on a surface of the substrate and electrolessly plating an amorphous seed layer on the catalytically active layer, the Ra of the resultant surface of the amorphous seed layer being reduced from that of the substrate, thereby providing a substantially defect-free surface for deposition thereon of magnetic recording media layers thereon. Embodiments include sputter depositing an catalytically active layer of Ni--Al or Ni--P and electrolessly plating an amorphous seed layer of Ni--P thereon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.