Stainless steel sheet having Cu-enriched grains dispersed in its matrix and/or a Cu-condensed layer
US6316117A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2000 |
| Grant date | Nov 13, 2001 |
| Priority date | — |
| Expiry date | Sep 20, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12479
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A new stainless steel sheet has a stainless steel substrate which contains Cu at a ratio of 1.0 wt. % or more and has Cu-enriched grains precipitated at a ratio of 0.2 vol. %. The Cu-enriched grains are exposed to the outside through pinholes in a passive film generated on the substrate. Cu is preferably condensed at a Cu/(Cr+Si) weight ratio of 0.1 or more or a Cu/(Si+Mn) weight ratio of 0.5 or more with respect to Cr, Si and Mn present in the passive film or at an outermost layer of the substrate. Precipitation of Cu-enriched grains and condensation of Cu effectively improve solderability and electric conductivity of the stainless steel sheet.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.