Apparatus and method of planarizing a semiconductor wafer that includes a first reflective substance and a second reflective substance
US6316276A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 17, 1998 |
| Grant date | Nov 13, 2001 |
| Priority date | — |
| Expiry date | Dec 17, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/763
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of planarizing a semiconductor that includes (i) a substrate material, (ii) a first reflective substance positioned on the substrate material, (iii) an intermediate material positioned on the first reflective substance, wherein a channel is defined in a structure which includes the substrate, the first reflective substance, and the intermediate material, and (iv) a second reflective substance positioned on the intermediate material and in the channel is disclosed. The method includes the steps of (i) directing light onto a first side of the semiconductor wafer, (ii) polishing the first side of the semiconductor wafer in order to remove matter therefrom and expose the first reflective substance, the matter including the second reflective substance and the intermediate material, (iii) detecting when light directed in the directing step is simultaneously reflected by (A) the first reflective substance positioned on the substrate, and (B) the second reflective substance positioned in the channel, and generating an endpoint detection signal in response thereto, and (iv) terminating the polishing step in response to generation of the endpoint detection signal. An associated appa…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.