Methods for fabricating a multiple modular assembly
US6316278A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 16, 1999 |
| Grant date | Nov 13, 2001 |
| Priority date | — |
| Expiry date | Mar 16, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/117
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods and apparatus for fabricating a multiple display modular assembly. In one example of a method, a first flexible layer is coupled to a substrate, a second flexible layer is coupled to the first flexible layer, and a third flexible layer is coupled to the second flexible layer. Each of the flexible layers may be generated from a separate web-line process. In one example, one flexible layer may have a display plane with a driver backplane, a second flexible layer may have a fine interconnect, and a third flexible layer may have gross interconnect. The multiple flexible layer modular assembly may apply to either flexible or rigid displays.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.