Component for use in forming printed circuit boards
US6316733A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 18, 2000 |
| Grant date | Nov 13, 2001 |
| Priority date | — |
| Expiry date | Aug 18, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4611
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A component for use in manufacturing printed circuits that in a finished printed circuit constitutes a functional element. The component is comprised of a film substrate formed of a first polymeric material having a first side and a second side. At least one layer of a tiecoat metal is applied to the first side of the film substrate. At least one layer of copper on the at least one layer of a tiecoat metal, the layer of copper having an essentially uncontaminated exposed surface facing away from the at least one layer of tiecoat metal. A plurality of spaced apart, adhesion promoting areas of a tiecoat metal are provided on the second side of the film substrate defining regions of exposed polymeric material on the second side of the film substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.