Making a connection between a component and a circuit board
US6316737A · kind A · utility
64Cited by
94References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 9, 1999 |
| Grant date | Nov 13, 2001 |
| Priority date | — |
| Expiry date | Sep 9, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In general, in one aspect, the invention features a connection between a through-hole in a circuit board and a contact region on a component. The contact region has a surface bearing a depression. A continuous solder column has one end of that forms a solder joint with an inner wall of the through-hole and the other end of that forms a solder joint with the contact region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.