Moldless semiconductor device and photovoltaic device module making use of the same
US6316832A · kind A · utility
60Cited by
8References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 13, 1998 |
| Grant date | Nov 13, 2001 |
| Priority date | — |
| Expiry date | Nov 13, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A moldless semiconductor device comprising a semiconductor chip held between outer-connecting terminals and connected electrically to the terminals is provided. At least one of the two terminals has, at its region contiguous to the semiconductor chip or at its region contiguous to the semiconductor chip and a region vicinal thereto, a hardness different from all other regions of the one terminal. This moldless semiconductor device can withstand significant external force and exhibits high reliability when used in photovoltaic device modules.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.