Semiconductor device
US6316838A · kind A · utility
475Cited by
6References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 20, 2000 |
| Grant date | Nov 13, 2001 |
| Priority date | — |
| Expiry date | Mar 20, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a substrate provided with a plurality of leads, a face-down semiconductor element provided on one surface of the substrate, a first stacked semiconductor element and a second stacked semiconductor element provided on another surface of the substrate and connected to the substrate by wires, and an extended wiring mechanism for connecting electrodes of the face-down semiconductor element and electrodes of the first and second semiconductor elements. The connected electrodes are equi-electrodes whose electrical characteristics are equal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.