Modular preamplifier head circuit layout
US6317862A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 16, 1999 |
| Grant date | Nov 13, 2001 |
| Priority date | — |
| Expiry date | Aug 16, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/012
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A preamplifier chip for a disk drive is modular in layout. Twelve head cells for the preamplifier chip are not lined along the periphery of the chip, but rather are disposed in an array including four rows of three head cells each. The rows are all directed perpendicular to the side with control connection pads. The preferred embodiment allows for a smaller preamplifier chip through increasing the density of head cells on the chip relative to the periphery of the chip usable for head cell connection. The array spaces write portions of the head cells in four spaced lines, minimizing problems associated with heat build up. Spacing between rows of the array can be determined to take maximum advantage of lead pitch on the flex circuit. Modification of the design to a chip for eight or four channels is possible with minimal changes to the design, and minimal reworking of the common circuitry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.