Integrated packaging system for optical communications devices that provides automatic alignment with optical fibers
US6318909A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 11, 1999 |
| Grant date | Nov 20, 2001 |
| Priority date | — |
| Expiry date | Feb 11, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4292
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An integrated packaging system that comprises an integral mechanical support, a printed circuit board and the optical communications device. The mechanical support includes a first support element and a second support element. The first support element extends at a non-zero angle from the second support element. The printed circuit board includes a first portion and a second portion in contact with the first support element and the second support element, respectively. The optical communications device is mechanically coupled to the first support element of the mechanical support and is electrically connected to the first portion of the printed circuit board. The integrated packaging system preferably provides automatic alignment between the optical communications device and one or both of an optical element and an optical fiber. In this case, the first support element includes a device alignment feature. The device alignment feature and the optical communications device have a defined positional relationship with respect to one another. Alternatively, the system may additionally comprise a cover assembly including a cover comprising a device alignment feature. The cover is mechani…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.