Injection molding nozzle apparatus
US6318990A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 3, 2000 |
| Grant date | Nov 20, 2001 |
| Priority date | — |
| Expiry date | Jul 3, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2045/2761
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Injection molding apparatus wherein a heated nozzle extends into an opening in a cooled mold. The nozzle has a locating and sealing ring made of a deformable material. After installation the locating and sealing ring contacts an inwardly tapered surface of the mold or an insert seated in the mold extending around the opening. When the nozzle is heated to the operating temperature, thermal expansion drives the locating and sealing ring forwardly into greater contact against the inwardly tapered surface. In one embodiment, the locating and sealing ring is near the front of the nozzle, and the nozzle also has a rear locating flange. During insertion of the nozzle into place in the opening and thermal expansion of the nozzle, the rear locating flange first comes into contact with an inwardly tapered shoulder extending around the opening which prealigns the nozzle. Then before the front locating and sealing ring comes into contact with the inwardly tapered surface and is partially deformed thereby which very accurately align the tip of the nozzle with the gate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.