Thermal management system
US6319114A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 11, 1999 |
| Grant date | Nov 20, 2001 |
| Priority date | — |
| Expiry date | Nov 11, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB01D2273/30
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A thermal management system for an enclosure housing devices which generate heat inside the enclosure. A fan, whose speed is responsive to an input signal, has a gas flow output in communication with the enclosure. A filter is disposed in the gas flow path of the fan's output. At least one temperature sensor is disposed in the enclosure for measuring the temperature inside the enclosure. A controller adjusts the speed of the fan until the temperature inside the enclosure is within a predetermined range to ensure that the devices inside the enclosure do not overheat. A processor compares the signal input to the fan with the speed of the fan to determine the condition of the fan and, in response to the temperature sensor, determines the condition of the filter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.