Liquid curable resin composition
US6319603A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Mar 2, 1999 |
| Grant date | Nov 20, 2001 |
| Priority date | — |
| Expiry date | Mar 2, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2938
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A liquid curable resin composition comprising (1) a (meth)acrylate polymer having a weight average molecular weight relative to polystyrene standard of at least about 5,000, (2) a ring-opening polymerizable monomer containing at least one epoxy group, and (3) a cationic photopolymerization initiator is disclosed. The composition produces cured products which exhibit superior heat resistance, excellent mechanical strength, and superb adhesive characteristics, and is suitable for use as a photo-curable adhesive, a photo-curable sealing material, a resin for optical three-dimensional molding, and a coating material for optical fibers, and optical fiber ribbon matrix.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.