Integrated electronic micromodule and method for making same
US6319827A · kind A · utility
36Cited by
0References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 1, 2001 |
| Grant date | Nov 20, 2001 |
| Priority date | — |
| Expiry date | Mar 1, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic micromodule includes a support wafer, and an integrated circuit chip on the support wafer. The integrated circuit chip includes electrical connector areas, and at least one insulation layer is on the support wafer and the integrated circuit chip. The insulation layer includes openings to the electrical connector areas. At least one flat winding defining a coil is on the insulation layer and is connected to the electrical connector areas. A conducting material is in in each of the openings through the insulation layer for connecting the coil to the electrical zconnector areas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.