Solvent-free applicable heat-curing coating material
US6319973A · kind A · utility
5Cited by
7References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 22, 1999 |
| Grant date | Nov 20, 2001 |
| Priority date | — |
| Expiry date | Jul 22, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09D201/00
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Solvent-free applicable curable coating material containing as binder inorganic polymers and/or organic polymers, cross-linkers and sliding aids.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.