Water borne pressure sensitive vinyl acetate/ethylene adhesive compositions
US6319978A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 1, 1998 |
| Grant date | Nov 20, 2001 |
| Priority date | — |
| Expiry date | Oct 1, 2018 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/28
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention is directed to improved vinyl acetate ethylene pressure sensitive adhesive emulsion polymers. The improvement in the aqueous based, emulsion polymerized pressure sensitive adhesives resides in: PA1 a high ethylene content copolymer having a Tg of from -25 to -70.degree. C.; PA1 a tensile storage modulus measured at one hertz and at a temperature of -20.degree. C. embraced by the points on a plot of storage modulus and temperature of from 1 times 10.sup.6 and the points 4 times 10.sup.9 dynes/cm.sup.2 and less that 1 times 10.sup.7 dynes/cm.sup.2 measured at 50.degree. C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.