Yield monitoring system for a slicing apparatus
US6320141A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 12, 1999 |
| Grant date | Nov 20, 2001 |
| Priority date | — |
| Expiry date | Oct 12, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB26D2210/02
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention provides a yield monitoring system for a slicing and packaging apparatus. In accordance with one embodiment of the system, the system includes at least one product input scale, a slicing mechanism for slicing the product after the product has been weighed on the at least one product input scale, and at least one product output scale capable of weighing the product after slicing by the slicing mechanism to determine a post-processing weight. A yield monitor is connected to electronically receive weight information corresponding to the weight of product weighed by the at least one product input scale and the at least one product output scale. The yield monitor uses the received weight information to provide system yield data to a user via a screen, print-out, electronic data, etc.. Preferably, the system also includes a makeweight scale that is disposed at a makeweight station. The makeweight scale is connected to electronically communicate makeweight data to the yield monitor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.