Circuitry and method of forming the same
US6320241A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Aug 17, 1999 |
| Grant date | Nov 20, 2001 |
| Priority date | — |
| Expiry date | Aug 17, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/47
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A circuit between at least a connective terminal and at least a semiconductor circuit device includes at least a resistive element; a first interconnection inter-connecting a first side portion of the resistive element to the semiconductor circuit device; and a second interconnection inter-connecting a second side portion of the resistive element to the connective terminal, wherein at least a center portion except for the first and second side portions of the resistive element extends on a thin insulator portion which is provided on a semiconductor region, so that the thin insulator portion is sandwiched between the semiconductor region and the at least the center portion of the resistive element. The first and second portions of the resistive element extend on a thick insulator portion which is thicker than the thin insulator portion, and the semiconductor region is electrically connected to the second interconnection so as to allow a potential of the semiconductor region to follow a potential of the resistive element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.