Retention mechanism for tall PCB components
US6320755A · kind A · utility
0Cited by
10References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 6, 1999 |
| Grant date | Nov 20, 2001 |
| Priority date | — |
| Expiry date | Aug 6, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0264
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An improved assembly for a computer that includes at least two through hole mounted components, which are mounted to a printed circuit board, and a heat resistant strip mounted to the top of each of those components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.