Connection substrate

US6321443A · kind A · utility

Assignees

• Dyconex Patente AG · CH
• Atotech Deutschland GmbH & Co. KG · DE
• Ciba Specialty Chemicals Corporation · US
• Fraunhofer-Gesellschaft zur förderung der angewandten Forschung e.V. · DE
• Techn. Universitaet Dresden · DE

Inventors

• Hans-Jurg Barte · Detmold, DE
• Ewald Losert · Birsfelden, CH
• Heinrich Meyer · Berlin, DE
• Gunter Rohrs · Dippoldiswalde, DE
• Frank Rudolf · Neustadt bei Coburg, DE
• Wolfgang Scheel · Berlin, DE
• Walter Schmidt
• Theis Zur Nieden

Key dates

• Filing date: May 13, 1998
• Grant date: Nov 27, 2001
• Expiry date: May 13, 2018

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49155
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

The method for the manufacture of multilayer connecting substrates with multiple functions comprises the design of the connecting substrate taking place in functionally separated manner, in that signal conducting substrate parts (19), power supplying substrate parts (2), mechanical substrate parts (7), as well as the arrangement of components (4) or component-carrying substrate parts is separately planned and optimized as independent functions or modules and finally associated with spatially separated functional areas (inner/outer) of the overall circuit, the design taking place by the connection of the modules to an overall circuit embodying the connecting substrate. The resulting multilayer circuit with conductor network (19, 2), components (4) and mechanical stiffening elements (7) has the following structure. The substrate parts with the fine, dense and flexible elements are associated with the inner areas of the overall circuit, the substrate parts with the rigid elements and/or components are associated with the outer areas of the overall circuit and a stiffening support material is so placed in the outer area that the circuit is given a mechanical support structure, which is…