Method of making surface acoustic wave device
US6321444A · kind A · utility
26Cited by
0References
9Claims
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Assignee
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Key dates
| Filing date | Apr 11, 2000 |
| Grant date | Nov 27, 2001 |
| Priority date | — |
| Expiry date | Apr 11, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
In a surface-acoustic-wave (SAW) device and method of fabricating the same, a SAW chip is flip-chip mounted in a package. The package has a window facing an electrode formed surface of the SAW chip. After the SAW chip is mounted, the in-process item is inserted into reactive ion etching equipment, with the window open. The substrate or electrodes of the SAW chip is etched by an etching gas introduced into the ion etching equipment. Films may be formed on the electrode formation surface, in place of etching. Thus, variation in characteristics stemming from variations in manufacturing processes can be suppressed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.