Colloidal polishing of fused silica
US6322425A · kind A · utility
4Cited by
4References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 30, 1999 |
| Grant date | Nov 27, 2001 |
| Priority date | — |
| Expiry date | Jul 30, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/888
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A polishing application uses alkali, colloidal silica for polishing silicate-based glasses. Preferably, the silica solutions are adjusted to a pH of or above 10. The polished silicate-based glass surfaces have surface finishes consistently below 2 .ANG. Ra. The unique method first polishes a surface of the substrate with an aqueous solution of at least one metal oxide abrasive and further polishes the surface of the substrate with an alkali aqueous solution of colloidal silica. Preferably, to the final smoothness of 2 .ANG. Ra or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.