Multiple head dispensing method
US6322854A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 22, 2000 |
| Grant date | Nov 27, 2001 |
| Priority date | — |
| Expiry date | Aug 22, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/0469
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multiple head dispensing system and method is provided. In one embodiment, a dispensing system for dispensing material onto a substrate includes a plurality of independently operable dispensing heads, and a conveyor system, disposed beneath the plurality of dispensing heads, having a first track and a second track, each of which is constructed and arranged to convey substrates to working positions beneath the dispensing heads. The dispensing system may include a plurality of gantry systems, each of which is coupled to one of the plurality of independently operable dispensing heads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.