Method of fabricating a semiconductor device
US6323059A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 17, 2000 |
| Grant date | Nov 27, 2001 |
| Priority date | — |
| Expiry date | Apr 17, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S2304/12
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A conductive mounting board provided in a package has recessed portion and a projecting portion, and an insulating mounting board is disposed on the recessed portion. The insulating mounting board is disposed on the recessed portion. The insulating mounting board has an insulating board on the surface of which a wiring portion is disposed. A semiconductor laser, constituted by stacked semiconductor layers each being made from a compound semiconductor composed of a group III based nitride, is disposed on the insulating mounting board and the conductive mounting board. An n-side electrode of the semiconductor laser is in contact with the insulating mounting board and a p-side electrode thereof is in contact with the conductive mounting board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.