Passivated copper surfaces
US6323131A · kind A · utility
103Cited by
4References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 13, 1998 |
| Grant date | Nov 27, 2001 |
| Priority date | — |
| Expiry date | Jun 13, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31605
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A ULSI circuit chip comprising copper interconnects is provided with a corrosion protection passivating layer on the surface of the copper which layer is comprised of a self assembled organic monolayer formed from treating the copper surface with a dilute solution of, for example a thio-bisalkyl acetoacetonate. A similar layer can be formed under the copper to provide a barrier layer against copper migration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.