Metal core multilayer resin wiring board with thin portion and method for manufacturing the same
US6323439A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 31, 1999 |
| Grant date | Nov 27, 2001 |
| Priority date | — |
| Expiry date | Aug 31, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer resin wiring board includes a metal core substrate having a first main surface and a second main surface; a plurality of wiring layers located on the first and second main surfaces of the metal core substrate; a plurality of insulating resin layers, each intervening between the metal core substrate and the wiring layers and between the metal core substrate and the wiring layers and between the wiring layers; and a via formed on the wall of a through hole for connection to the metal core substrate extending through the insulating resin layers and the metal core substrate so as to establish electrical conductivity to the metal core substrate. The metal core substrate has a thin portion which is thinner than the remaining portion of the metal core substrate. The through hole for connection to the metal core substrate is formed through the thin portion by laser machining.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.