Apparatus capable of high power dissipation during burn-in of a device under test
US6323665A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 6, 1998 |
| Grant date | Nov 27, 2001 |
| Priority date | — |
| Expiry date | Oct 6, 2018 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2874
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A system and method for burning-in an integrated circuit chip including at least a socket capable of receiving and supporting the chip, electrical leads in the socket for connecting to corresponding leads on the chip, and a heat sink in thermal contact with a cooling medium. The heat sink includes a thermal interface in releasable thermal contact with the integrated circuit in the socket. The heat sink removes more heat from the integrated circuit than is generated during the burn-in process and the integrated circuit is maintained within a predetermined desired temperature range by monitoring the temperature of the integrated circuit and supplying make-up heat as needed. Multiple sockets can be grouped together and cooled by a manifolded cooling system, with the temperature of each integrated circuit being individually monitored and controlled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.