Heat-dissipating apparatus for an integrated circuit device
US6324058A · kind A · utility
Inventor
Key dates
| Filing date | Oct 25, 2000 |
| Grant date | Nov 27, 2001 |
| Priority date | — |
| Expiry date | Oct 25, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipating apparatus includes a base member that has an upright surrounding wall portion confining a receiving space, and a top wall for closing a top side of the receiving space. The base member is adapted to be disposed on a circuit board with an integrated circuit device accommodated within the receiving space. The top wall is formed with a serpentine fluid groove that opens downwardly, and that has a fluid inlet in fluid communication with a first groove end, and a fluid outlet in fluid communication with a second groove end. A thermoelectric cooling unit is disposed in the receiving space, and has a heat-absorbing side adapted to be placed in contact with a heat-generating side of the integrated circuit device, and a heat-releasing side opposite to the heat-absorbing side. The cooling unit is adapted to separate the integrated circuit device from the fluid groove. A washer member is disposed in the receiving space below the cooling unit. The washer member has an inner peripheral portion formed with a through hole to contain the integrated circuit device therein, an outer peripheral portion in a fluid-tight seal with the surrounding wall portion, a top surface in a flui…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.